Show simple item record

dc.contributor.advisor Bavarian, Behzad en
dc.contributor.author Polack, Joshua E. en
dc.date.accessioned 2017-04-19T18:51:45Z en
dc.date.available 2017-04-19T18:51:45Z en
dc.date.copyright 1991 en
dc.date.issued 1991-12 en
dc.identifier.uri http://hdl.handle.net/10211.3/190074 en
dc.description Includes bibliographical references (pages 52-53) en
dc.description.abstract Lead-based soft solder alloys are used in the field of power hybrid microcircuits to provide low-stress component bonds. In this study solder joints were thermally aged and cycled in order to investigate the mechanisms of solder degradation. The samples were shear tested and examined by scanning electron microscopy. The cause of solder joint degradation was determined to be the segregation of intermetallic compounds from the lead-rich solder matrix. The application of plastic shear strain during thermal cycling formed severe microcracks between the lead-depleted compounds and the lead-rich matrix, resulting in a weak or fractured bond. en
dc.description.statementofresponsibility by Joshua E. Polack en
dc.format.extent viii, 94 pages en
dc.language.iso en en
dc.rights.uri http://scholarworks.csun.edu//handle/10211.2/286 en
dc.subject.other Dissertations, Academic -- CSUN -- Engineering en
dc.title Soft solder joints in power hybrid microcircuits en
dc.type Thesis en
dc.date.updated 2017-04-19T18:51:45Z en
dc.contributor.department California State University, Northridge. Department of Engineering en
dc.description.degree M.S. en
dc.contributor.committeeMember Shively, Jon en
dc.contributor.committeeMember Roosta, Ramin en
dc.rights.license By signing and submitting this license, you the author grant permission to California State University, Northridge Graduate Studies to submit your thesis or dissertation, and any additional associated files you provide, to CSUN Scholarworks, the institutional repository of the California State University, Northridge, on your behalf.You grant to CSUN Scholarworks the non-exclusive right to reproduce and/or distribute your submission worldwide in electronic or any medium for non-commercial, academic purposes. You agree that CSUN Scholarworks may, without changing the content, translate the submission to any medium or format, as well as keep more than one copy, for the purposes of security, backup and preservation. You represent that the submission is your original work, and that you have the right to grant the rights contained in this license. You also represent that your submission does not, to the best of your knowledge, infringe upon anyone's copyright. If the submission contains material for which you do not hold copyright, or for which the intended use is not permitted, or which does not reasonably fall under the guidelines of fair use, you represent that you have obtained the unrestricted permission of the copyright owner to grant CSUN Scholarworks the rights required by this license, and that such third-party owned material is clearly identified and acknowledged within the text or content of the submission. If the submission is based upon work that has been sponsored or supported by an agency or organization other than the California State University, Northridge, you represent that you have fulfilled any right of review or other obligations required by such contract or agreement. CSUN Scholarworks will clearly identify your name(s) as the author(s) or owner(s) of the submission, and will not make any alterations, other than those allowed by this license, to your submission. en


Files in this item

Icon

This item appears in the following Collection(s)

Show simple item record

Search DSpace


My Account

RSS Feeds