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dc.contributor.advisor Bavarian, Behzad en Polack, Joshua E. en 2017-04-19T18:51:45Z en 2017-04-19T18:51:45Z en 1991 en 1991-12 en
dc.identifier.uri en
dc.description Includes bibliographical references (pages 52-53) en
dc.description.abstract Lead-based soft solder alloys are used in the field of power hybrid microcircuits to provide low-stress component bonds. In this study solder joints were thermally aged and cycled in order to investigate the mechanisms of solder degradation. The samples were shear tested and examined by scanning electron microscopy. The cause of solder joint degradation was determined to be the segregation of intermetallic compounds from the lead-rich solder matrix. The application of plastic shear strain during thermal cycling formed severe microcracks between the lead-depleted compounds and the lead-rich matrix, resulting in a weak or fractured bond. en
dc.description.statementofresponsibility by Joshua E. Polack en
dc.format.extent viii, 94 pages en
dc.language.iso en en
dc.rights.uri en
dc.subject.other Dissertations, Academic -- CSUN -- Engineering en
dc.title Soft solder joints in power hybrid microcircuits en
dc.type Thesis en 2017-04-19T18:51:45Z en
dc.contributor.department California State University, Northridge. Department of Engineering en M.S. en
dc.contributor.committeeMember Shively, Jon en
dc.contributor.committeeMember Roosta, Ramin en
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